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3 edition of Thin Films: Stresses and Mechanical Properties VI found in the catalog.

Thin Films: Stresses and Mechanical Properties VI

Symposium Held April 8-12, 1996, San Francisco, California, U.S.A. (Materials Research Society Symposium Proceedings Volume 436)

by

  • 275 Want to read
  • 33 Currently reading

Published by Materials Research Society .
Written in English

    Subjects:
  • Material Science,
  • Reference,
  • Technology,
  • Technology & Industrial Arts,
  • Science/Mathematics

  • Edition Notes

    ContributionsWilliam W. Gerberich (Editor), Huajian Gao (Editor), Jan-Eric Sundgren (Editor), Shefford P. Baker (Editor)
    The Physical Object
    FormatHardcover
    Number of Pages542
    ID Numbers
    Open LibraryOL12091908M
    ISBN 101558993398
    ISBN 109781558993396

      The mechanical hardness of the different phases of tantalum nitride (TaN x, x ≤ 1) thin films grown by the reactive planar dc magnetron sputtering technique at °C have been evaluated. The different phases have been prepared by varying the nitrogen (N 2) to argon (Ar) gas ratio R in the range – The phases present in each sample and their volume fractions are obtained from x Cited by: Glass is a material with essentially unlimited application possibilities. This second edition of a comprehensive reference in glass science, points out the correlation between the performance of industrial processes and practice-relevant properties, such as strength and optical properties. Interdisciplinary in his approach, the author discusses both the science and technology, starting with .   Thin films deposited at °C demonstrate the highest value of power factor: × 10 −3 W m −1 K −2 at K and × 10 −3 W m −1 K −2 at K. Due to the high electrical conductivity value, the thermoelectric performance of thin films deposited at °C is enhanced in comparison with previous reports for thin films ( Cited by: This study comprises an investigation of highly reflective thin film for microelectro- mechanical systems (MEMS) consisting of reflective components. For these applications, the desired film system must have (1) low stress, (2) high specular reflectivity, (3) improved nano-hardness relative to pure aluminum, (4) compatibility with traditional semiconductor fabrication by: 5.


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Thin Films: Stresses and Mechanical Properties VI Download PDF EPUB FB2

Interest in the mechanical properties of thin films remains high throughout the world, as evidenced by the large international contingent represented in this book.

With regard to stresses, techniques for sorting out residual stress and strain states are becoming more varied and : Hardcover. - Thin Films: Stresses and Mechanical Properties: Materials Research Society Symposium Proceedings: Volume Editors: John C.

Bravman, William D. Nix, David M. Barnett and David A. Smith Frontmatter More informationFile Size: KB. Virtually, all properties of thin films (electronic, magnetic, optical, ferroelecrtic, multiferroic etc.) are affected if not chiefly governed by the elastic coupling of "order" parameters with strains and such, especially Thin Films: Stresses and Mechanical Properties VI book nanoscopic length scales.

This book is primarily devoted to mechanical behavior of thin films in an isolated by: Introduction. In this chapter we turn our attention to mechanical properties and the stresses that develop in thin films on substrates. One usually thinks of mechanical properties, such as elastic modulus and yield strength, as properties of importance for only structural materials, where load bearing is the primary by: 5.

This chapter is devoted to the mechanical properties of TiNi thin films. In this chapter, the shape memory behavior, two-way shape memory effect, superelasticity and stress–strain curves of sputter-deposited TiNi films are discussed with special attention to unique microstructures in Ti-rich TiNi films.

Shape memory behavior of TiNi thin films. Stress Analysis and Mechanical Characterization of Thin Films for Microelectronics and MEMS Applications Patrick Waters University of South Florida Follow this and additional works at: Part of theAmerican Studies Commons.

One of the simplest ways to measure the mechanical properties of a thin film is to deform it on a very small scale. Because indentation testing with a sharp indenter is one convenient means to accomplish this, nanoindentation, or indentation testing at the nanometer scale, has become one of the most widely used techniques for measuring the mechanical properties of thin by: Handbook of Thin Film Deposition, Fourth Edition, is a comprehensive reference focusing on thin film technologies and applications used in the semiconductor industry and the closely related areas of thin film deposition, thin film micro properties, photovoltaic solar energy applications, materials for memory applications and methods for thin film optical processes.

The book is broken up into three. Quandt, in Encyclopedia of Materials: Science and Technology, Thin film actuators in the case of piezoelectric or magnetostrictive materials are always used as compounds with micromachined substrates working as bending transducers, whereas in the case of shape memory thin films both free-standing thin film actuators and compounds with metallic or silicon substrates are realized.

thin film. The easiest and most common way of inferring film stress in a thin film-wafer substrate system due to some process is to measure the curvature of the system before and after that process. The change in curvature then can be directly related to the film stress.

The classical relation between film stress and wafer curvature is known as the. Thin film technology is a relatively young and ever-growing field in the physical and chemical sciences, which is confluence of materials science, surface science, applied physics and applied chemistry. Thin film technology has its objectives in the provision for scientific bases for the methods and materials used in thin film electronics (integrated circuits and micro-electro-mechanical Author: N.

Sharma, M. Hooda, S. Sharma. The mechanics and microstructural mechanisms controlling the stresses and mechanical properties of thin metallic films on substrates are studied. Techniques for measuring stresses in thin films, including both X-ray diffraction and substrate curvature methods, and the physical processes that lead to these stresses, including thermal, epitaxial and intrinsic processes, are described.

Thin Film Shape Memory Alloys: Fundamentals and Device Applications The first dedicated to this exciting and rapidly growing field, this book enables readers to understand and prepare high-quality, high-performance TiNi shape memory alloys (SMAs). It covers the properties. Part of the Springer Series in Optical Sciences book series (SSOS, volume 88) The mechanical properties of thin films like stress, density, adhesion, hardness and abrasion resistance are, like structure and morphology, primarily dependent on the coating material and the kind of deposition process applied for their by: The residual stresses in thin films greatly determine its performance and surface integrity since adhesion or cracking resistance can be changed.

The excessive amounts of stress states either compressive or tensile will eventually end up in severe failure problems. This book is the second edition of the popular book on thin-film deposition by Klaus K. Schuegraf.

The previous edition is more than twelve years old. While the fundamentals have not changed, the. Nanoindentation is a technique commonly used for measuring thin film mechanical properties such as hardness and stiffness.

In this study, we used the finite element method to investigate the effect of substrate and pileup on hardness and stiffness measurements of thin film by: The mechanical properties and thermal stresses of hydrogen silsesquioxane (HSQ) thin films cured at different temperatures have been investigated by a nanoindentor and a profilometer.

In this study, the correlations between structure change, SiH/SiO ratio, modulus, hardness, and calculated CTE of HSQ films have been by: 1. Origin of residual stresses in thin films 1. Epitaxial stresses Epitaxial stresses arise when films have perfectly coherent interfaces with their substrates, i.e., when the crystal lattices in film and substrates line up perfectly.

a s a f σ mfσ e.g. Cubic on cubic: Fe on GaAS, AlAs on GaAS Cubic on hcp: {} plane in cubic film on (   These conducting films are also important for fundamental investigations in physics, radio-physics and physical chemistry.

Physical Properties of Thin Metal Films provides a clear presentation of the complex physical properties particular to thin conducting films and includes the necessary theory, confirming experiments and by: Thin Films for MEMS Devices 5 Thin Film Deposition 5 Chemical Vapor Deposition (CVD) 6 CVD Mechanism 6 Advantages of CVD 8 Research Objective 11 CHAPTER 2 12 Mechanical Characterization of Thin Films 12 Bulge Test 13 Micro-Beam Bending 15 Micro Tensile Test The effect of main chain stiffness and side chain flexibility on the elastic modulus and glass transition temperature (Tg) of thin polymer films is investigated using nontraditional polymers formed from 5-(2-phenylethylnorbornene).

Depending on the polymerization route chosen, the resulting polymer backbone is comprised of either bicyclic (norbornyl) units, which leads to a relatively rigid Cited by:   Substrate effects on the measurement of thin film mechanical properties by nanoindentation methods have been studied experimentally using a model soft film on hard substrate system: aluminum on glass.

you will be asked to authorise Cambridge Core to connect with your account. C., and Pharr, G.M., in Thin Films: Stresses and Cited by: A thin film is a layer of material ranging from fractions of a nanometer to several micrometers in thickness. The controlled synthesis of materials as thin films (a process referred to as deposition) is a fundamental step in many applications.

A familiar example is the household mirror, which typically has a thin metal coating on the back of a sheet of glass to form a reflective interface. Corpus ID: Residual stress analysis in 3C-SiC thin films by substrate curvature method @inproceedings{CarballoResidualSA, title={Residual stress analysis in 3C-SiC thin films by substrate curvature method}, author={Jose M.

Carballo}, year={} }. T1 - Characterization of mechanical properties and residual stresses for Ni- Co thin films. AU - Ahn, Joong Hyok. AU - Bae, Hong Yeol. AU - Kim, Yun-Jae. AU - Park, Jun Hyub.

PY - /12/1. Y1 - /12/1. N2 - The present work characterizes mechanical (elastic and plastic) properties and residual stresses of a Ni-Co thin film having m Author: Joong Hyok Ahn, Hong Yeol Bae, Yun-Jae Kim, Jun Hyub Park.

The nanomechanical properties of various polymers were examined in light of nanoindentation experiments performed with a diamond tip of nominal radius of curvature of about 20 μm under conditions of maximum contact load in the range of – μN and loading/unloading rates between and μN/ by: Thin Film Coatings for Biomaterials and Biomedical Applications discusses the latest information on coatings, including their historic use by scientists who are looking to improve the properties and biological responses of the material-host interface.

Thin films, in particular, are becoming more widely researched and used as an alternative to traditional sprayed coatings because they have a. Residual Stress Development in CU Thin Films with and Without AlN Passivation by Cyclic Plane Bending Article in International Journal of Modern Physics B 24(15) June with 2 Reads.

The very idea of a thin film presumes the existence of a substrate; the difference in form and properties between film and substrate are fundamental to the state of stress in both the film and the substrate. Some useful values of mechanical properties of a few common substrate materials are given in.

Nanoindentation load-displacement curves provide a “mechanical fingerprint” of a materials response to contact deformation. Over the last few years, much attention has been focused on understanding the factors controlling the detailed shape of unloading curves so that parameters such as true contact area, Young's modulus, and an indentation hardness number can be by: vi Foreword vii – Introduction 1 - Polysilicon stress-strain at temperature and CTE.

1 - Case Western silicon carbide. 8 - Other thin-film materials. 9 - Diamond stress-strain curves. 15 - Polysilicon fatigue.

17 - Polysilicon creep. 20 - Thin film microstructural studies. 22 - Modeling of thin films Cited by: through the mechanical buckling of a thin film.

In this thesis, we focus on the buckling mechanism. The wavy patterns are generated when the thin elastic film is subjected to an in-plane compressive stress and by the application of controlled heating.

We first introduce the mechanism of developing wave patterns through buckling using beam. affects the mechanical properties of the material. The development of Material Pockets, which are used to hold a powder or film for use in a DMA, have opened the door for many different materials to be analyzed in the DMA Figure 3 shows data from the testing of thin films made by curing a layer of adhesive in the material pocket.

This method. My students and I also studied high temperature dispersion strengthening mechanisms and described the effects of threshold stresses on these creep processes.

Since the mid's we have focused most of our attention on the mechanical properties of thin film materials used in. Universal testing machine for mechanical properties of thin materials E. Huerta⁄, J.E.

Corona, and A.I. Oliva Centro de Investigacion y de Estudios Avanzados del Instituto Polit´ ecnico Nacional,´ Unidad M´erida, Departamento de F ´ısica Aplicada, Apartado Postal Cordemex, Merida Yucat´ an, M´ ´exico, e-mail: [email protected] I have fabricated thin films of SiC and observed that the physical properties of the films are quite different from its bulk.

The particle size of grown films is in the range of nm whereas. The results indicated that they are almost comparable to those of bulk specimens. On the other hand, Ti-rich Ti-Ni thin films were found to exhibit a good shape memory behavior owing to a peculiar fine microstructure unlike bulk specimens.

Addition of Cu or Pd to a Tiat.%Ni thin film was also confirmed to improve the shape memory by: Structure, Mechanical Properties and Fracture Behavior of Organosilicate Glass Thin Films Abstract Organosilicate glass (OSG) thin films with low permittivity made by means of plasma enhanced chemical vapor deposition are the inter-metal insulator in advanced integrated circuits.

Book Chapters and Review Articles: Ion Beam Analysis and Modification of Thin Film High Temperature Superconductors, M. Nastasi, in Structure-Property Relations in Ion-Beam Surface Modified Ceramics-Theory and Practice, eds.

C.J. McHargue, R. Kossowsky, and W.O. Hofer (Kluwer Academic Publishers, Dordrecht, ) p. The January issue of the MRS Bulletin contains a collection of articles on Mechanical Properties in Small Dimensions (Vinci and Baker, ), within which one of the articles (Floro et al.

), containing several references, deals with the physical origins of intrinsic stress in (Volmer-Weber, i.e. island growth) thin films.Erratum: Size dependence in mechanical properties of gold at the micron scale in the absence of strain gradients (Acta Materialia ()53, 6 ()) Article Apr   This is the first book to discuss the correlation between the performance of industrial processes and practice-relevant properties, such as strength and optical properties.

Interdisciplinary in his approach, the author discusses both the science and technology, starting with glass past and present, its structure, and rheology.